Developments Toward a 250-nm, Fully Planarized Fabrication Process With Ten Superconducting Layers And Self-Shunted Josephson Junctions

Abstract

We are developing a superconductor electronics fabrication process with up to nine planarized superconducting layers, stackable stud vias, self-shunted Nb/AlOx-Al/Nb Josephson junctions, and one layer of MoNx kinetic inductors. The minimum feature size of resistors and inductors in the process is 250 nm. We present data on the mutual inductance of Nb stripline and microstrip inductors with linewidth and spacing from 250 nm to 1 μm made on the same or adjacent Nb layers, as well as the data on the linewidth and resistance uniformity.

Extended Abstract: 3 pages, 4 figures, 1 Table, 9 references. 16th International Superconductive Electronics Conference, ISEC 2017, 12-16 June 2017, Sorrento, Italy

References in corpus (6)

• Advanced Fabrication Processes for Superconducting Very Large Scale Integrated Circuits
• Superconductor Digital Electronics: Scalability and Energy Efficiency Issues
• Properties of Unshunted and Resistively Shunted Nb/AlOx-Al/Nb Josephson Junctions With Critical Current Densities from 0.1 mA/μm^2 to 1 mA/μm^2
• Inductance of Circuit Structures for MIT LL Superconductor Electronics Fabrication Process with 8 Niobium Layers
• AC-Biased Shift Registers as Fabrication Process Benchmark Circuits and Flux Trapping Diagnostic Tool
• New AC-Powered SFQ Digital Circuits

Cited by in corpus (5)

• Very Large Scale Integration of Josephson-Junction-Based Superconductor Random Access Memories
• Superconductor Electronics Fabrication Process with MoN${}_x$ Kinetic Inductors and Self-Shunted Josephson Junctions
• Inductance and mutual inductance of superconductor integrated circuit features with sizes down to 120 nm. Part I
• Planarized Fabrication Process With Two Layers of SIS Josephson Junctions and Integration of SIS and SFS π-Junctions
• Mutual and self-inductance in planarized multilayered superconductor integrated circuits: Microstrips, striplines, bends, meanders, ground plane perforations