activity
20112025
most citedAdvanced Fabrication Processes for Superconducting Very Large Scale Integrated Circuits

253 citations · 788 across the 16 of their papers we have counts for

collaborators

16 papers

cond-mat.supr-con2025

Fabrication and Properties of NbN/NbNx/NbN and Nb/NbNx/Nb Josephson Junctions

Sergey K. Tolpygo, Ravi Rastogi, David Kim +3

Increasing integration scale of superconductor electronics (SCE) requires employing kinetic inductors and self-shunted Josephson junctions (JJs) for miniaturizing inductors and JJs…

quant-ph2025

Reflection-less filter for superconducting quantum circuits

Jessica Kedziora, Eric Q. Bui, Alec Yen +4

Protecting superconducting quantum circuits from non-ideal return loss, including out-of-band circulator behavior and enhancing the performance of broadband quantum-limited amplifi…

cond-mat.supr-con2023

Development of Self-Shunted Josephson Junctions For a Ten-Superconductor-Layer Fabrication Process: Nb/NbN/Nb Junctions

Sergey K. Tolpygo, Ravi Rastogi, Terence Weir +2

To increase integration scale of superconductor electronics, we are developing a new, SFQ7ee, node of the fabrication process at MIT Lincoln Laboratory. In comparison to the existi…

cond-mat.supr-con2023★ 27 cited

Progress toward superconductor electronics fabrication process with planarized NbN and NbN/Nb layers

Sergey K. Tolpygo, Justin L. Mallek, Vladimir Bolkhovsky +5

To increase density of superconductor digital and neuromorphic circuits by 10x and reach integration scale of Josephson junctions (JJs) per chip, we developed a new fabricat…

cond-mat.supr-con2022★ 11 cited

Self- and Mutual Inductance of NbN and Bilayer NbN/Nb Inductors in Planarized Fabrication Process With Nb Ground Planes

Sergey K. Tolpygo, Evan B. Golden, Terence J. Weir +2

We present measurements of the self- and mutual inductance of NbN and bilayer NbN/Nb inductors with Nb ground plane(s) fabricated in an advanced process for superconductor electron…

cond-mat.supr-con2021★ 24 cited

Mutual and self-inductance in planarized multilayered superconductor integrated circuits: Microstrips, striplines, bends, meanders, ground plane perforations

Sergey K. Tolpygo, Evan B. Golden, Terence J. Weir +1

Data are presented on mutual and self-inductance of various inductors used in multilayered superconductor integrated circuits: microstrips and striplines with widths of signal trac…

cond-mat.supr-con2021★ 46 cited

Inductance and mutual inductance of superconductor integrated circuit features with sizes down to 120 nm. Part I

Sergey. K. Tolpygo, Evan B. Golden, Terence J. Weir +1

Data are presented on inductance of various features used in superconductor digital integrated circuits such as microstrip and stripline inductors with linewidths down to 120 nm an…

cond-mat.supr-con2019★ 29 cited

Planarized Fabrication Process With Two Layers of SIS Josephson Junctions and Integration of SIS and SFS π-Junctions

Sergey K. Tolpygo, Vladimir Bolkhovsky, Ravi Rastogi +6

We present our new fabrication Process for Superconductor Electronics (PSE2) that integrates two (2) layers of Josephson junctions in a fully planarized multilayer process on 200-m…

cond-mat.supr-con2017★ 15 cited

Developments Toward a 250-nm, Fully Planarized Fabrication Process With Ten Superconducting Layers And Self-Shunted Josephson Junctions

Sergey K. Tolpygo, Vladimir Bolkhovsky, Ravi Rastogi +5

We are developing a superconductor electronics fabrication process with up to nine planarized superconducting layers, stackable stud vias, self-shunted Nb/AlOx-Al/Nb Josephson junc…

cond-mat.supr-con2016★ 84 cited

Properties of Unshunted and Resistively Shunted Nb/AlOx-Al/Nb Josephson Junctions With Critical Current Densities from 0.1 mA/μm^2 to 1 mA/μm^2

Sergey K. Tolpygo, Vladimir Bolkhovsky, Scott Zarr +5

We investigated current-voltage characteristics of unshunted and externally shunted Josephson junctions (JJs) with high critical current densities, Jc, in order to extract their ba…

cond-mat.supr-con2015★ 253 cited

Advanced Fabrication Processes for Superconducting Very Large Scale Integrated Circuits

Sergey K. Tolpygo, Vladimir Bolkhovsky, T. J. Weir +4

We review the salient features of two advanced nodes of an 8-Nb-layer fully planarized process developed recently at MIT Lincoln Laboratory for fabricating Single Flux Quantum(SFQ)…

cond-mat.supr-con2014★ 172 cited

Fabrication Process and Properties of Fully-Planarized Deep-Submicron Nb/Al-AlOx/Nb Josephson Junctions for VLSI Circuits

Sergey K. Tolpygo, Vladimir Bolkhovsky, Terence J. Weir +3

A fabrication process for Nb/Al-AlOx/Nb Josephson junctions (JJs) with sizes down to 200 nm has been developed on a 200-mm-wafer tool set typical for CMOS foundry. This process is…

cond-mat.supr-con2014★ 77 cited

Inductance of Circuit Structures for MIT LL Superconductor Electronics Fabrication Process with 8 Niobium Layers

Sergey K. Tolpygo, Vladimir Bolkhovsky, T. J. Weir +4

Inductance of superconducting thin-film inductors and structures with linewidth down to 250 nm has been experimentally evaluated. The inductors include various striplines and micro…

cond-mat.supr-con2013★ 37 cited

Deep Sub-Micron Stud-Via Technology for Superconductor VLSI Circuits

Sergey K. Tolpygo, V. Bolkhovsky, T. Weir +3

A fabrication process has been developed for fully planarized Nb-based superconducting inter-layer connections (vias) with minimum size down to 250 nm for superconductor very large…

cond-mat.supr-con2012★ 1 cited

Shadow evaporation of epitaxial Al/Al2O3/Al tunnel junctions on sapphire utilizing an inorganic bilayer mask

Paul B. Welander, Vladimir Bolkhovsky, Terence J. Weir +2

This letter describes a new inorganic shadow mask that has been employed for the evaporation of all-epitaxial Al/Al2O3/Al superconducting tunnel junctions. Organic resists that are…

cond-mat.supr-con2011★ 12 cited

Sub-micrometer epitaxial Josephson junctions for quantum circuits

Jeffrey S. Kline, Michael R. Vissers, Fabio C. S. da Silva +11

We present a fabrication scheme and testing results for epitaxial sub-micrometer Josephson junctions. The junctions are made using a high-temperature (1170 K) "via process" yieldin…