How to Report and Benchmark Emerging Field-Effect Transistors
arXiv:2203.16759 · doi:10.1038/s41928-022-00798-8
Abstract
Emerging low-dimensional nanomaterials have been studied for decades in device applications as field-effect transistors (FETs). However, properly reporting and comparing device performance has been challenging due to the involvement and interlinking of multiple device parameters. More importantly, the interdisciplinarity of this research community results in a lack of consistent reporting and benchmarking guidelines. Here we report a consensus among the authors regarding guidelines for reporting and benchmarking important FET parameters and performance metrics. We provide an example of this reporting and benchmarking process for a two-dimensional (2D) semiconductor FET. Our consensus will help promote an improved approach for assessing device performance in emerging FETs, thus aiding the field to progress more consistently and meaningfully.
15 pages, 3 figures
References in corpus (6)
- 2D Materials for Future Heterogeneous Electronics
- Improved Contacts to MoS2 Transistors by Ultra-High Vacuum Metal Deposition
- High Current Density in Monolayer MoS Doped by AlO
- Intrinsic Electrical Transport and Performance Projections of Synthetic Monolayer MoS2 Devices
- Understanding contact gating in Schottky barrier transistors from 2D channels
- Statistical Analysis of Contacts to Synthetic Monolayer MoS2
Cited by in corpus (8)
- CMOS-compatible Strain Engineering for High-Performance Monolayer Semiconductor Transistors
- Liquid Metal Oxide-assisted Integration of High-k Dielectrics and Metal Contacts for Two-Dimensional Electronics
- Assessment of wafer-level transfer techniques of graphene with respect to semiconductor industry requirements
- Ultra-thin transistors and circuits for conformable electronics
- Mobility and Threshold Voltage Extraction in Transistors with Gate-Voltage-Dependent Contact Resistance
- Reducing the metal-graphene contact resistance through laser-induced defects
- Graphene-Quantum Dot Hybrid Photodetectors from 200 mm Wafer Scale Processing
- Dry Transfer Based on PMMA and Thermal Release Tape for Heterogeneous Integration of 2D-TMDC Layers