Multi-kV class -GaO MESFETs with a Lateral Figure of Merit up to 355 MW/cm
arXiv:2106.06661 · doi:10.1109/LED.2021.3100802
Abstract
We demonstrate over 3 kV gate-pad-connected field plated (GPFP) -GaO lateral MESFETs with high lateral figure of merit (LFOM) using metalorganic vapor phase epitaxy (MOVPE) grown channel layers and regrown ohmic contact layers. Using an improved low-temperature MOVPE selective area epitaxy process, we show that a total contact resistance to the channel as low as 1.4 .mm can be achieved.The GPFP design adopted here using PECVD (plasma-enhanced chemical vapor deposition) deposited SiN dielectric and SiN/SiO wrap-around passivation exhibits up to ~14% improved R, up to ~70% improved breakdown voltage (V = V - V) resulting in up to 3 higher LFOM compared to non-FP -GaO lateral MESFETs. The V (~2.5 kV) and LFOM (355 MW/cm) measured simultaneously in our GPFP -GaO lateral MESFET (with L = 10 m) is the highest value achieved in any depletion-mode -GaO lateral device.
6 pages, 5 figures
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Cited by in corpus (4)
- High-Mobility Tri-Gate -GaO MESFETs with a Power Figure of Merit over 0.9 GW/cm
- 4.4 kV -GaO Power MESFETs with Lateral Figure of Merit exceeding 100 MW/cm
- Record-High Electron Mobility and Controlled Low 10 cm Si-doping in (010) -GaO Epitaxial Drift Layers
- Low Resistance Ohmic Contact On Epitaxial MOVPE-grown -GaO and -(AlGa) O Films