paper

In-situ dielectric Al2O3/\b{eta}-Ga2O3 Interfaces Grown Using Metal-organic Chemical Vapor Deposition

arXiv:2103.15280 · doi:10.1002/aelm.202100333

Abstract

High-quality dielectric-semiconductor interfaces are critical for reliable high-performance transistors. We report the in-situ metalorganic chemical vapor deposition (MOCVD) of AlO on -GaO as a potentially better alternative to the most commonly used atomic layer deposition (ALD). The growth of AlO is performed in the same reactor as GaO using trimethylaluminum and O as precursors without breaking the vacuum at a growth temperature of 600 C. The fast and slow near interface traps at the AlO/ -GaO interface are identified and quantified using stressed capacitance-voltage (CV) measurements on metal oxide semiconductor capacitor (MOSCAP) structures. The density of shallow and deep level initially filled traps (D) are measured using ultra-violet (UV) assisted CV technique. The average D for the MOSCAP is determined to be 7.8 10 cmeV. The conduction band offset of the AlO/ GaO interface is also determined from CV measurements and found out to be 1.7 eV which is in close agreement with the existing literature reports of ALD AlO/ GaO interface. The current-voltage characteristics are also analyzed and the average breakdown field is extracted to be approximately 5.8 MV/cm. This in-situ AlO dielectric on -GaO with improved dielectric properties can enable GaO-based high performance devices.

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