Wafer-scale low-disorder 2DEG in Si/SiGe without an epitaxial Si cap
arXiv:2202.08090 · doi:10.1063/5.0088576
Abstract
We grow Si/SiGe heterostructures by reduced-pressure chemical vapor deposition and terminate the stack without an epitaxial Si cap but with an amorphous Si-rich layer obtained by exposing the SiGe barrier to dichlorosilane at 500 °C. As a result, Si/SiGe heterostructure field-effect transistors feature a sharp semiconductor/dielectric interface and support a two-dimensional electron gas with enhanced and more uniform transport properties across a 100 mm wafer. At T = 1.7 K we measure a high mean mobility of (1.80.5)10 cm/Vs and a low mean percolation density of (91)10 cm. From the analysis of Shubnikov-de Haas oscillations at T = 190 mK we obtain a long mean single particle relaxation time of (8.10.5) ps, corresponding to a mean quantum mobility and quantum level broadening of (7.50.6)10 cm/Vs and (403) eV, respectively, and a small mean Dingle ratio of (2.30.2), indicating reduced scattering from long range impurities and a low-disorder environment for hosting high-performance spin-qubits.
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