4.4 kV -GaO Power MESFETs with Lateral Figure of Merit exceeding 100 MW/cm
arXiv:2201.10028 · doi:10.35848/1882-0786/ac6729
Abstract
Field-plated (FP) depletion-mode MOVPE-grown -GaO lateral MESFETs are realized with superior reverse breakdown voltages and ON currents. A sandwiched SiN dielectric field plate design was utilized that prevents etching-related damage in the active region and a deep mesa-etching was used to reduce reverse leakage. The device with L = 34.5 m exhibits an ON current (I) of 56 mA/mm, a high I/I ratio 10 and a very low reverse leakage until catastrophic breakdown at 4.4kV. The highest measurable V recorded was 4.57 kV (L = 44.5 m). An LFOM of 132 MW/cm was calculated for a V of 4.4 kV. The reported results are the first 4kV-class GaO transistors to surpass the theoretical FOM of Silicon. These are also the highest I and lowest R values achieved simultaneously for any -GaO device with V 4kV to date. This work highlights that high breakdown voltages (V), high lateral figure of merit (LFOM) and high ON currents can be achieved simultaneously in -GaO lateral transistors.
4 pages, 5 figures
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