Indium-Tin-Oxide Transistors with One Nanometer Thick Channel and Ferroelectric Gating

Abstract

In this work, we demonstrate high performance indium-tin-oxide (ITO) transistors with the channel thickness down to 1 nm and ferroelectric Hf0.5Zr0.5O2 as gate dielectric. On-current of 0.243 A/mm is achieved on sub-micron gate-length ITO transistors with a channel thickness of 1 nm, while it increases to as high as 1.06 A/mm when the channel thickness increases to 2 nm. A raised source/drain structure with a thickness of 10 nm is employed, contributing to a low contact resistance of 0.15 Ωmm and a low contact resistivity of 1.1{\times}10-7 Ωcm2. The ITO transistor with a recessed channel and ferroelectric gating demonstrates several advantages over 2D semiconductor transistors and other thin film transistors, including large-area wafer-size nanometer thin film formation, low contact resistance and contact resistivity, atomic thin channel being immunity to short channel effects, large gate modulation of high carrier density by ferroelectric gating, high-quality gate dielectric and passivation formation, and a large bandgap for the low-power back-end-of-line (BEOL) CMOS application.

arXiv comment32 pages, 16 figures. To be published in ACS Nano

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• A Gate-All-Around Single-Channel In2O3 Nanoribbon FET with Near 20 mA/μm Drain Current
• A Nanometer-Thick Oxide Semiconductor Transistor with Ultra-High Drain Current
• The Critical Role of Charge Balance on the Memory Characteristics of Ferroelectric Field-Effect Transistors
• Computational Associative Memory with Amorphous InGaZnO Channel 3D NAND-Compatible FG Transistors