Scaled indium oxide transistors fabricated using atomic layer deposition
arXiv:2203.02869 · doi:10.1038/s41928-022-00718-w
Abstract
In order to continue to improve integrated circuit performance and functionality, scaled transistors with short channel lengths and low thickness are needed. But the further scaling of silicon-based devices and the development of alternative semiconductor channel materials that are compatible with current fabrication processes is challenging. Here we report atomic-layer-deposited indium oxide transistors with channel lengths down to 8 nm, channel thicknesses down to 0.5 nm and equivalent dielectric oxide thickness down to 0.84 nm. Due to the scaled device dimensions and low contact resistance, the devices exhibit high on-state currents of 3.1 A/mm at a drain voltage of 0.5 V and a transconductance of 1.5 S/mm at a drain voltage 1 V. Our devices are a promising alternative channel material for scaled transistors with back-end-of-line processing compatibility.
arXiv comment30 pages, 9 figures. Nat Electron (2022)
References in corpus (5)
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Cited by in corpus (4)
- A Gate-All-Around Single-Channel In2O3 Nanoribbon FET with Near 20 mA/μm Drain Current
- A Nanometer-Thick Oxide Semiconductor Transistor with Ultra-High Drain Current
- Growth and applications of two-dimensional single crystals
- Two-dimensional Indium Oxide at the Epitaxial Graphene/SiC Interface: Synthesis, Structure, Properties, and Devices