Contact resistance extraction of graphene FET technologies based on individual device characterization
arXiv:2005.13926 · doi:10.1016/j.sse.2020.107882
Abstract
Straightforward contact resistance extraction methods based on electrical device characteristics are described and applied here to graphene field-effect transistors from different technologies. The methods are an educated adaptation of extraction procedures originally developed for conventional transistors by exploiting the drift-diffusion-like transport in graphene devices under certain bias conditions. In contrast to other available approaches for contact resistance extraction of graphene transistors, the practical methods used here do not require either the fabrication of dedicated test structures or internal device phenomena characterization. The methodologies are evaluated with simulation-based data and applied to fabricated devices. The extracted values are close to the ones obtained with other more intricate methodologies. Bias-dependent contact and channel resistances studies, bias-dependent high-frequency performance studies and contact engineering studies are enhanced and evaluated by the extracted contact resistance values.
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- An extraction method for mobility degradation and contact resistance of graphene transistors
- Unveiling the impact of the bias-dependent charge neutrality point on graphene-based multi-transistor applications
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- Accuracy of Y-function methods for parameters extraction of two-dimensional FETs across different technologies
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- Bias-dependent intrinsic RF thermal noise modeling and characterization of single layer graphene FETs