Local removal of silicon layers on Si(100)-2x1 with chlorine-resist STM lithography
arXiv:2001.04845 · doi:10.1016/j.apsusc.2019.145235
Abstract
We report the realization of STM-based lithography with silicon layers removal on the chlorinated Si(100)-2x1 surface at 77 K. In contrast to other STM lithography studies, we were able to remove locally both chlorine and silicon atoms. Most of the etched pits have a lateral size of 10-20 A and a depth of 1-5 A. In the pits in which the STM image with atomic resolution is obtained, the bottom is mainly covered with chlorine. Some pits contain chlorine vacancies. Mechanisms of STM-induced removal of silicon and chlorine atoms on Si(100)-2x1-Cl are discussed and compared with the well-studied case of STM-induced hydrogen desorption on Si(100)-2x1-H. The results open up new possibilities of the three-dimensional local etching with STM lithography.
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Cited by in corpus (9)
- Roadmap on Atomic-scale Semiconductor Devices
- Chlorine insertion and manipulation on the Si(100)-2x1-Cl surface in the regime of local supersaturation
- Dangling bonds on the Cl- and Br-terminated Si(100) surfaces
- PBr3 Adsorption and Dissociation on the Si(100) Surface
- Hydrogen inserted into the Si(100)-2x1-H surface: A first-principles study
- Transitions between positive and negative charge states of dangling bonds on a halogenated Si(100) surface
- Enhancing the reactivity of Si(100)-Cl toward PBr3 by charging Si dangling bonds
- Dopant Precursor Adsorption into Single-Dimer Windows: Towards Guided Self-Assembly of Dopant Arrays on Si(100)
- Reactivity of the Si(100)-21-Cl surface with respect to PH, PCl, and BCl: Comparison with PH on Si(100)-21-H