Area-selective deposition and B -doping of Si(100) with BCl
arXiv:2103.07529 · doi:10.1021/acsami.1c10616
Abstract
B-doped -layers were fabricated in Si(100) using BCl as a dopant precursor in ultrahigh vacuum. BCl adsorbed readily at room temperature, as revealed by scanning tunneling microscopy (STM) imaging. Annealing at elevated temperatures facilitated B incorporation into the Si substrate. Secondary ion mass spectrometry (SIMS) depth profiling demonstrated a peak B concentration 1.2(1) 10 cm with a total areal dose of 1.85(1) 10 cm resulting from a 30 L BCl dose at 150 C. Hall bar measurements of a similar sample were performed at 3.0 K revealing a sheet resistance of = 1.91 k, a hole concentration of = 1.90 10 cm and a hole mobility of = 38.0 cmVs without performing an incorporation anneal. Further, the conductivity of several B-doped -layers showed a log dependence on temperature suggestive of a two-dimensional system. Selective-area deposition of BCl was also demonstrated using both H- and Cl-based monatomic resists. In comparison to a dosed area on bare Si, adsorption selectivity ratios for H and Cl resists were determined by SIMS to be 310(10):1 and 1529(5):1, respectively, further validating the use of BCl as a dopant precursor for atomic precision fabrication of acceptor-doped devices in Si.
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