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20232026
most citedThe Dawn of AI-Native EDA: Opportunities and Challenges of Large Circuit Models

21 citations · 26 across the 18 of their papers we have counts for

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Showing 2024Show all

6 papers · 1 filter

cs.AR2024

Theseus: Exploring Efficient Wafer-Scale Chip Design for Large Language Models

Jingchen Zhu, Chenhao Xue, Yiqi Chen +13

The emergence of the large language model~(LLM) poses an exponential growth of demand for computation throughput, memory capacity, and communication bandwidth. Such a demand growth…

cs.AR2024★ 3 cited

LayoutCopilot: An LLM-powered Multi-agent Collaborative Framework for Interactive Analog Layout Design

Bingyang Liu, Haoyi Zhang, Xiaohan Gao +5

Analog layout design heavily involves interactive processes between humans and design tools. Electronic Design Automation (EDA) tools for this task are usually designed to use scri…

cs.AR2024★ 21 cited

The Dawn of AI-Native EDA: Opportunities and Challenges of Large Circuit Models

Lei Chen, Yiqi Chen, Zhufei Chu +36

Within the Electronic Design Automation (EDA) domain, AI-driven solutions have emerged as formidable tools, yet they typically augment rather than redefine existing methodologies.…

cs.AR2024

EasyACIM: An End-to-End Automated Analog CIM with Synthesizable Architecture and Agile Design Space Exploration

Haoyi Zhang, Jiahao Song, Xiaohan Gao +4

Analog Computing-in-Memory (ACIM) is an emerging architecture to perform efficient AI edge computing. However, current ACIM designs usually have unscalable topology and still heavi…

cs.LG2024

PDNNet: PDN-Aware GNN-CNN Heterogeneous Network for Dynamic IR Drop Prediction

Yuxiang Zhao, Zhuomin Chai, Xun Jiang +3

IR drop on the power delivery network (PDN) is closely related to PDN's configuration and cell current consumption. As the integrated circuit (IC) design is growing larger, dynamic…

cs.AR2024

Analytical Heterogeneous Die-to-Die 3D Placement with Macros

Yuxuan Zhao, Peiyu Liao, Siting Liu +3

This paper presents an innovative approach to 3D mixed-size placement in heterogeneous face-to-face (F2F) bonded 3D ICs. We propose an analytical framework that utilizes a dedicate…