6 citations · 9 across the 2 of their papers we have counts for
4 papers
ATSim3.5D: A Multiscale Thermal Simulator for 3.5D-IC Systems based on Nonlinear Multigrid Method
Qipan Wang, Tianxiang Zhu, Yibo Lin +2
To resolve the rising temperatures in 3.5D-ICs, a thermal-aware design flow becomes increasingly crucial, necessitating an accurate and efficient thermal simulation tool. However,…
ATSim3D: Towards Accurate Thermal Simulator for Heterogeneous 3D-IC Systems Considering Nonlinear Leakage and Conductivity
Qipan Wang, Tianxiang Zhu, Yibo Lin +2
Thermal simulation plays a fundamental role in the thermal design of integrated circuits, especially 3D ICs. Current simulators require significant runtime for high-resolution simu…
GAP-LA: GPU-Accelerated Performance-Driven Layer Assignment
Chunyuan Zhao, Zizheng Guo, Zuodong Zhang +1
Layer assignment is critical for global routing of VLSI circuits. It converts 2D routing paths into 3D routing solutions by determining the proper metal layer for each routing segm…
AnalogXpert: Automating Analog Topology Synthesis by Incorporating Circuit Design Expertise into Large Language Models
Haoyi Zhang, Shizhao Sun, Yibo Lin +2
Analog circuits are crucial in modern electronic systems, and automating their design has attracted significant research interest. One of major challenges is topology synthesis, wh…