paper

Germanium wafers for strained quantum wells with low disorder

arXiv:2305.08971 · doi:10.1063/5.0158262

Abstract

We grow strained Ge/SiGe heterostructures by reduced-pressure chemical vapor deposition on 100 mm Ge wafers. The use of Ge wafers as substrates for epitaxy enables high-quality Ge-rich SiGe strain-relaxed buffers with a threading dislocation density of (61)10 cm, nearly an order of magnitude improvement compared to control strain-relaxed buffers on Si wafers. The associated reduction in short-range scattering allows for a drastic improvement of the disorder properties of the two-dimensional hole gas, measured in several Ge/SiGe heterostructure field-effect transistors. We measure an average low percolation density of (1.220.03)10 cm, and an average maximum mobility of (3.40.1)10 cm/Vs and quantum mobility of (8.40.5)10 cm/Vs when the hole density in the quantum well is saturated to (1.650.02)10 cm. We anticipate immediate application of these heterostructures for next-generation, higher-performance Ge spin-qubits and their integration into larger quantum processors.

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