Reduced Thermal Conductivity of Supported and Encased Monolayer and Bilayer MoS
arXiv:2007.05032 · doi:10.1088/2053-1583/aba4ed
Abstract
Electrical and thermal properties of atomically thin two-dimensional (2D) materials are affected by their environment, e.g. through remote phonon scattering or dielectric screening. However, while it is known that mobility and thermal conductivity (TC) of graphene are reduced on a substrate, these effects are much less explored in 2D semiconductors such as MoS. Here, we use molecular dynamics to understand TC changes in monolayer (1L) and bilayer (2L) MoS by comparing suspended, supported, and encased structures. The TC of monolayer MoS is reduced from ~117 WmK when suspended, to ~31 WmK when supported by SiO, at 300 K. Encasing 1L MoS in SiO further reduces its TC down to ~22 WmK. In contrast, the TC of 2L MoS is not as drastically reduced, being >50% higher than 1L both when supported and encased. These effects are due to phonon scattering with remote vibrational modes of the substrate, which are partly screened in 2L MoS. We also examine the TC of 1L MoS across a wide range of temperatures (300 to 700 K) and defect densities (up to 510 cm), finding that the substrate reduces the dependence of TC on these factors. Taken together, these are important findings for all applications which will use 2D semiconductors supported or encased by insulators, instead of freely suspended.
19 Pages, 7 Figures, Supplementary Information
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- Quantitative predictions of the thermal conductivity in transition metal dichalcogenides: The impact of point defects in MoS and WS monolayers
- Thermal boundary conductance of CVD-grown MoS monolayer-on-silica substrate determined by scanning thermal microscopy
- Substrate-Dependence of Monolayer MoS Thermal Conductivity and Thermal Boundary Conductance