SOT-MRAM 300mm integration for low power and ultrafast embedded memories
arXiv:1810.10356 · doi:10.1109/VLSIC.2018.8502269
Abstract
We demonstrate for the first time full-scale integration of top-pinned perpendicular MTJ on 300 mm wafer using CMOS-compatible processes for spin-orbit torque (SOT)-MRAM architectures. We show that 62 nm devices with a W-based SOT underlayer have very large endurance (> 5x10^10), sub-ns switching time of 210 ps, and operate with power as low as 300 pJ.
arXiv commentpresented at VLSI2018 session C8-2
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