79 citations
Counting papers with at most 25 authors, so collaboration author lists do not stand in for the people here.
- University of Maryland, College ParkUS2 papers
- B. Verkin Institute for Low Temperature Physics and Engineering of the National Academy of Sciences of UkraineUA1 paper
- Friedrich-Alexander-Universität Erlangen-NürnbergDE1 paper
- Indian Institute of Technology MadrasIN1 paper
- National Academy of Sciences of UkraineUA1 paper
- National University of SingaporeSG1 paper
- Oak Ridge National LaboratoryUS1 paper
- SLAC National Accelerator LaboratoryUS1 paper
- Trevecca Nazarene UniversityUS1 paper
Showing 2011 · cond-mat.mtrl-sciShow all
2 papers · 2 filters
cond-mat.mtrl-sci2011★ 10 cited
Noncontact electrical metrology of Cu/low-k interconnect for semiconductor production wafers
V. V. Talanov, A. Scherz, A. R. Schwartz
We have demonstrated a technique capable of in-line measurement of dielectric constant of low-k interconnect films on patterned wafers utilizing a test key of ~50x50 μm in size. Th…
cond-mat.mtrl-sci2011★ 32 cited
Noncontact dielectric constant metrology of low-k interconnect films using a near-field scanned microwave probe
Vladimir V. Talanov, André Scherz, Robert L. Moreland +1
We present a method for noncontact, noninvasive measurements of dielectric constant, k, of 100-nm- to 1.5-μm-thick blanket low-k interconnect films on up to 300 mm in diameter wafe…