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20232026
most citedThe Dawn of AI-Native EDA: Opportunities and Challenges of Large Circuit Models

21 citations · 26 across the 18 of their papers we have counts for

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9 papers · 1 filter

cs.AR2026

PANDA: An LLM-Enhanced Performance-Driven Analog Design Framework Bridging Design Intent and Layout Generation

Haoyi Zhang, Weijian Fan, Xiaohan Gao +3

Traditional design of analog circuits heavily relies on manual interventions across topology, sizing, and layout, with prior automation addressing stages in isolation. In this work…

cs.AR2024

Theseus: Exploring Efficient Wafer-Scale Chip Design for Large Language Models

Jingchen Zhu, Chenhao Xue, Yiqi Chen +13

The emergence of the large language model~(LLM) poses an exponential growth of demand for computation throughput, memory capacity, and communication bandwidth. Such a demand growth…

cs.AR2024★ 3 cited

LayoutCopilot: An LLM-powered Multi-agent Collaborative Framework for Interactive Analog Layout Design

Bingyang Liu, Haoyi Zhang, Xiaohan Gao +5

Analog layout design heavily involves interactive processes between humans and design tools. Electronic Design Automation (EDA) tools for this task are usually designed to use scri…

cs.AR2024★ 21 cited

The Dawn of AI-Native EDA: Opportunities and Challenges of Large Circuit Models

Lei Chen, Yiqi Chen, Zhufei Chu +36

Within the Electronic Design Automation (EDA) domain, AI-driven solutions have emerged as formidable tools, yet they typically augment rather than redefine existing methodologies.…

cs.AR2024

EasyACIM: An End-to-End Automated Analog CIM with Synthesizable Architecture and Agile Design Space Exploration

Haoyi Zhang, Jiahao Song, Xiaohan Gao +4

Analog Computing-in-Memory (ACIM) is an emerging architecture to perform efficient AI edge computing. However, current ACIM designs usually have unscalable topology and still heavi…

cs.AR2024

Analytical Heterogeneous Die-to-Die 3D Placement with Macros

Yuxuan Zhao, Peiyu Liao, Siting Liu +3

This paper presents an innovative approach to 3D mixed-size placement in heterogeneous face-to-face (F2F) bonded 3D ICs. We propose an analytical framework that utilizes a dedicate…

cs.AR2023

Post-Layout Simulation Driven Analog Circuit Sizing

Xiaohan Gao, Haoyi Zhang, Siyuan Ye +6

Post-layout simulation provides accurate guidance for analog circuit design, but post-layout performance is hard to be directly optimized at early design stages. Prior work on anal…

cs.AR2023★ 2 cited

Analytical Die-to-Die 3D Placement with Bistratal Wirelength Model and GPU Acceleration

Peiyu Liao, Yuxuan Zhao, Dawei Guo +2

In this paper, we present a new analytical 3D placement framework with a bistratal wirelength model for F2F-bonded 3D ICs with heterogeneous technology nodes based on the electrost…

cs.AR2023

READ: Reliability-Enhanced Accelerator Dataflow Optimization using Critical Input Pattern Reduction

Zuodong Zhang, Renjie Wei, Meng Li +3

With the rapid advancements of deep learning in recent years, hardware accelerators are continuously deployed in more and more safety-critical applications such as autonomous drivi…