9 citations · 16 across the 9 of their papers we have counts for
9 papers
Network Design for Wafer-Scale Systems with Wafer-on-Wafer Hybrid Bonding
Patrick Iff, Tommaso Bonato, Maciej Besta +2
Transformer-based large language models are increasingly constrained by data movement as communication bandwidth drops sharply beyond the chip boundary. Wafer-scale integration usi…
VMXDOTP: A RISC-V Vector ISA Extension for Efficient Microscaling (MX) Format Acceleration
Max Wipfli, Gamze İslamoğlu, Navaneeth Kunhi Purayil +2
Compared to the first generation of deep neural networks, dominated by regular, compute-intensive kernels such as matrix multiplications (MatMuls) and convolutions, modern decoder-…
Design in Tiles: Automating GEMM Deployment on Tile-Based Many-PE Accelerators
Aofeng Shen, Chi Zhang, Yakup Budanaz +4
Tile-based many-Processing Element (PE) accelerators can achieve competitive performance on General Matrix Multiplication (GEMM), but they are extremely hard to program, as their o…
PerfDojo: Automated ML Library Generation for Heterogeneous Architectures
Andrei Ivanov, Siyuan Shen, Gioele Gottardo +5
The increasing complexity of machine learning models and the proliferation of diverse hardware architectures (CPUs, GPUs, accelerators) make achieving optimal performance a signifi…
Evaluating IOMMU-Based Shared Virtual Addressing for RISC-V Embedded Heterogeneous SoCs
Cyril Koenig, Enrico Zelioli, Luca Benini
Embedded heterogeneous systems-on-chip (SoCs) rely on domain-specific hardware accelerators to improve performance and energy efficiency. In particular, programmable multi-core acc…
A Multi-level Compiler Backend for Accelerated Micro-kernels Targeting RISC-V ISA Extensions
Alexandre Lopoukhine, Federico Ficarelli, Christos Vasiladiotis +6
High-performance micro-kernels must fully exploit today's diverse and specialized hardware to deliver peak performance to DNNs. While higher-level optimizations for DNNs are offere…
PlaceIT: Placement-based Inter-Chiplet Interconnect Topologies
Patrick Iff, Benigna Bruggmann, Maciej Besta +2
2.5D integration technology is gaining traction as it copes with the exponentially growing design cost of modern integrated circuits. A crucial part of a 2.5D stacked chip is a low…
RapidChiplet: A Toolchain for Rapid Design Space Exploration of Chiplet Architectures
Patrick Iff, Benigna Bruggmann, Blaise Morel +3
Chiplet architectures are on the rise as they promise to overcome the scaling challenges of monolithic chips. A key component of such architectures is an efficient inter-chiplet in…
OSMOSIS: Enabling Multi-Tenancy in Datacenter SmartNICs
Mikhail Khalilov, Marcin Chrapek, Siyuan Shen +7
Multi-tenancy is essential for unleashing SmartNIC's potential in datacenters. Our systematic analysis in this work shows that existing on-path SmartNICs have resource multiplexing…