Computational Design of Two-Dimensional MoSiN Family Field-Effect Transistor for Future Ångström-Scale CMOS Technology Nodes
arXiv:2506.21366
Abstract
Advancing complementary metal-oxide-semiconductor (CMOS) technology into the sub-1-nm angström-scale technology nodes is expected to involve alternative semiconductor channel materials, as silicon transistors encounter severe performance degradation at physical gate lengths below 10 nm. Two-dimensional (2D) semiconductors have emerged as strong candidates for overcoming short-channel effects due to their atomically thin bodies, which inherently suppress electrostatic leakage and improve gate control in aggressively scaled field-effect transistors (FETs). Among the growing library of 2D materials, the MoSiN family -- a synthetic septuple-layered materials -- has attracted increasing attention for its remarkable ambient stability, suitable bandgaps, and favorable carrier transport characteristics, making it a promising platform for next-generation transistors. While experimental realization of sub-10-nm 2D FETs remains technologically demanding, computational device simulation using first-principles density functional theory combined with nonequilibrium Green's function transport simulations provide a powerful and cost-effective route for exploring the performance limits and optimal design of ultrascaled FET. This review consolidates the current progress in the computational design of MoSiN family FETs. We review the physical properties of MoSiN that makes them compelling candidates for transistor applications, as well as the simulated device performance and optimization strategy of MoSiN family FETs. Finally, we identify key challenges and research gaps, and outline future directions that could accelerate the practical deployment of MoSiN family FET in the angström-scale CMOS era.
27 pages, 11 figures