A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints
arXiv:2204.05583 · doi:10.1016/j.ijplas.2022.103308
Abstract
This paper presents a multi-scale modelling approach to investigate the underpinning mechanisms of microstructure-sensitive damage of single crystal Sn-3Ag-0.5Cu (wt%, SAC305) solder joints of a Ball Grid Array (BGA) board assembly subject to thermal cycling. The multi-scale scheme couples board-scale modelling at the continuum macro-scale and individual solder modelling at the crystal micro-scale. Systematic studies of tin crystal orientation and its role in fatigue damage have been compared to experimental observations. Crystallographic orientation is examined with respect to damage development, providing evidence-based optimal solder microstructural design for in-service thermomechanical fatigue.
References in corpus (1)
Cited by in corpus (3)
- The role of microstructure in the thermal fatigue of solder joints
- Multi-scale plasticity homogenization of Sn-3Ag-0.5Cu: from β-Sn micropillars to polycrystals with intermetallics
- Frequency-dependent stress response under thermal cycle: A thermal-crystal plasticity and dynamic mode decomposition study