76 citations · 166 across the 3 of their papers we have counts for
3 papers
cond-mat.mtrl-sci2023★ 76 cited
The role of microstructure in the thermal fatigue of solder joints
J. W. Xian, Y. L. Xu, S. Stoyanov +3
Thermal fatigue is a common failure mode in electronic solder joints, yet the role of microstructure is incompletely understood. Here, we quantify the evolution of microstructure a…
cond-mat.mtrl-sci2022★ 16 cited
Multi-scale plasticity homogenization of Sn-3Ag-0.5Cu: from β-Sn micropillars to polycrystals with intermetallics
Yilun Xu, Tianhong Gu, Jingwei Xian +4
The mechanical properties of -Sn single crystals have been systematically investigated using a combined methodology of micropillar tests and rate-dependent crystal plasticity mo…
cond-mat.mtrl-sci2022★ 74 cited
A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints
Yilun Xu, Jingwei Xian, Stoyan Stoyanov +4
This paper presents a multi-scale modelling approach to investigate the underpinning mechanisms of microstructure-sensitive damage of single crystal Sn-3Ag-0.5Cu (wt%, SAC305) sold…