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cond-mat.mtrl-sci2023
The role of microstructure in the thermal fatigue of solder joints
J. W. Xian, Y. L. Xu, S. Stoyanov +3
Thermal fatigue is a common failure mode in electronic solder joints, yet the role of microstructure is incompletely understood. Here, we quantify the evolution of microstructure a…
cond-mat.mtrl-sci2022★ 74 cited
A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints
Yilun Xu, Jingwei Xian, Stoyan Stoyanov +4
This paper presents a multi-scale modelling approach to investigate the underpinning mechanisms of microstructure-sensitive damage of single crystal Sn-3Ag-0.5Cu (wt%, SAC305) sold…