74 citations · 113 across the 4 of their papers we have counts for
4 papers
Multi-scale plasticity homogenization of Sn-3Ag-0.5Cu: from β-Sn micropillars to polycrystals with intermetallics
Yilun Xu, Tianhong Gu, Jingwei Xian +4
The mechanical properties of -Sn single crystals have been systematically investigated using a combined methodology of micropillar tests and rate-dependent crystal plasticity mo…
A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints
Yilun Xu, Jingwei Xian, Stoyan Stoyanov +4
This paper presents a multi-scale modelling approach to investigate the underpinning mechanisms of microstructure-sensitive damage of single crystal Sn-3Ag-0.5Cu (wt%, SAC305) sold…
The role of lengthscale in the creep of Sn-3Ag-0.5Cu solder microstructures
Tianhong Gu, Christopher M. Gourlay, T. Ben Britton
Creep of directionally solidified Sn-3Ag-0.5Cu wt.% (SAC305) samples with near-<110> orientation along the loading direction and different microstructural lengthscale is investigat…
In-situ study of creep in Sn-3Ag-0.5Cu solder
Tianhong Gu, Vivian Tong, Christopher M. Gourlay +1
The creep behaviour and microstructural evolution of a Sn-3Ag-0.5Cu wt.% sample with a columnar microstructure have been investigated through in-situ creep testing under constant s…