◍wovepaper
SearchResearchersInstitutions
Sign in
researcher

C. Gourlay

3 papers hereh-index 424.7k citations165 works total

Matching runs newest-first, so older work may not be attached to this profile yet.

author position
  • middle author3

Across the 3 of 3 papers where every author was matched, so the position is known.

fields
  • cond-mat.mtrl-sci2
  • physics.app-ph1

identity via Semantic Scholar / OpenAlex

most citedA multi-scale approach to microstructure-sensitive thermal fatigue in solder joints

74 citations · 74 across the 2 of their papers we have counts for

collaborators
Showing physics.app-phShow all

1 paper · 1 filter

physics.app-ph2020

The role of lengthscale in the creep of Sn-3Ag-0.5Cu solder microstructures

Tianhong Gu, Christopher M. Gourlay, T. Ben Britton

Creep of directionally solidified Sn-3Ag-0.5Cu wt.% (SAC305) samples with near-<110> orientation along the loading direction and different microstructural lengthscale is investigat…

◍wovepaper

Papers, researchers and institutions, woven together.

Explore
  • Search
  • Researchers
  • Institutions
Account
  • Library
  • Chat
Data
  • arXiv.org
  • Semantic Scholar
  • OpenAlex
  • Latest RSS
AboutContactPrivacyDevelopersllms.txtopenapi.json
Not affiliated with arXiv. Researcher data from Semantic Scholar (ODC-BY) and OpenAlex.