74 citations · 74 across the 1 of their papers we have counts for
2 papers
cond-mat.mtrl-sci2022★ 74 cited
A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints
Yilun Xu, Jingwei Xian, Stoyan Stoyanov +4
This paper presents a multi-scale modelling approach to investigate the underpinning mechanisms of microstructure-sensitive damage of single crystal Sn-3Ag-0.5Cu (wt%, SAC305) sold…
cond-mat.mtrl-sci2019
In-situ electron backscatter diffraction of thermal cycling in a single grain Cu/Sn-3Ag-0.5Cu/Cu solder joint
Tianhong Gu, Christopher M. Gourlay, T. Ben Britton
The heterogeneous evolution of microstructure in a single Cu/SAC305/Cu solder joint is investigated using in-situ thermal cycling combined with electron backscatter diffraction (EB…