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20192023
most citedA multi-scale approach to microstructure-sensitive thermal fatigue in solder joints

74 citations · 104 across the 4 of their papers we have counts for

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cond-mat.mtrl-sci2019

In-situ electron backscatter diffraction of thermal cycling in a single grain Cu/Sn-3Ag-0.5Cu/Cu solder joint

Tianhong Gu, Christopher M. Gourlay, T. Ben Britton

The heterogeneous evolution of microstructure in a single Cu/SAC305/Cu solder joint is investigated using in-situ thermal cycling combined with electron backscatter diffraction (EB…