74 citations · 74 across the 2 of their papers we have counts for
2 papers
cond-mat.mtrl-sci2022★ 74 cited
A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints
Yilun Xu, Jingwei Xian, Stoyan Stoyanov +4
This paper presents a multi-scale modelling approach to investigate the underpinning mechanisms of microstructure-sensitive damage of single crystal Sn-3Ag-0.5Cu (wt%, SAC305) sold…
cs.OH2008
Open Ended Microwave Oven for Packaging
K. I. Sinclair, T. Tilford, M. Y. P. Desmulliez +4
A novel open waveguide cavity resonator is presented for the combined variable frequency microwave curing of bumps, underfills and encapsulants, as well as the alignment of devices…