Towards controllable Si-doping in oxide molecular beam epitaxy using a solid SiO source: Application to -Ga2O3
arXiv:2202.05762 · doi:10.1063/5.0087987
Abstract
The oxidation-related issues in controlling Si doping from the Si source material in oxide molecular beam epitaxy (MBE) is addressed by using solid SiO as an alternative source material in a conventional effusion cell. Line-of-sight quadrupole mass spectrometry of the direct SiO-flux () from the source at different temperatures () confirmed SiO molecules to sublime with an activation energy of 3.3eV. The -dependent was measured in vacuum before and after subjecting the source material to an O-background of mbar (typical oxide MBE regime). The absence of a significant difference indicates negligible source oxidation in molecular O. Mounted in an oxygen plasma-assisted MBE, Si-doped -Ga2O3 layers were grown using this source. The at the substrate was evaluated [from 2.9x10 cms (=700°C) to 5.5x10 cms (T=1000°C)] and Si-concentration in the -Ga2O3 layers measured by secondary ion mass spectrometry highlighting unprecedented control of continuous Si-doping for oxide MBE, i.e., from 4x10 cm (=700°C) up to 1.7x10 cm (=900°C). For a homoepitaxial -Ga2O3 layer an Hall charge carrier concentration of 3x10 cm in line with the provided (=800°C) is demonstrated. No SiO-incorporation difference was found between -Ga2O3(010) layers homoepitaxially grown at 750°C and -Ga2O3(-201) layers heteroepitaxially grown at 550°C. The presence of activated oxygen (plasma) resulted in partial source oxidation and related decrease of doping concentration (particularly at <800°C) which has been tentatively explained with a simple model. Degassing the source at 1100°C reverted the oxidation.
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