High Coherence Plane Breaking Packaging for Superconducting Qubits

Abstract

We demonstrate a pogo pin package for a superconducting quantum processor specifically designed with a nontrivial layout topology (e.g., a center qubit that cannot be accessed from the sides of the chip). Two experiments on two nominally identical superconducting quantum processors in pogo packages, which use commercially available parts and require modest machining tolerances, are performed at low temperature (10 mK) in a dilution refrigerator and both found to behave comparably to processors in standard planar packages with wirebonds where control and readout signals come in from the edges. Single- and two-qubit gate errors are also characterized via randomized benchmarking. More detailed crosstalk measurements indicate levels of crosstalk less than -40 dB at the qubit frequencies, opening the possibility of integration with extensible qubit architectures.

9 pages, 5 figures, 2 tables

References in corpus (11)

• Charge insensitive qubit design derived from the Cooper pair box
• Surface codes: Towards practical large-scale quantum computation
• Hardware-efficient Variational Quantum Eigensolver for Small Molecules and Quantum Magnets
• Detecting arbitrary quantum errors via stabilizer measurements on a sublattice of the surface code
• Detecting bit-flip errors in a logical qubit using stabilizer measurements
• Scalable quantum circuit and control for a superconducting surface code
• Interqubit coupling mediated by a high-excitation-energy quantum object
• Wirebond crosstalk and cavity modes in large chip mounts for superconducting qubits
• Generalized switchable coupling for superconducting qubits using double resonance
• Switchable coupling for superconducting qubits using double resonance in the presence of crosstalk
• Extensible 3D architecture for superconducting quantum computing

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