Extensible 3D architecture for superconducting quantum computing

Abstract

Using a multi-layered printed circuit board, we propose a 3D architecture suitable for packaging supercon- ducting chips, especially chips that contain two-dimensional qubit arrays. In our proposed architecture, the center strips of the buried coplanar waveguides protrude from the surface of a dielectric layer as contacts. Since the contacts extend beyond the surface of the dielectric layer, chips can simply be flip-chip packaged with on-chip receptacles clinging to the contacts. Using this scheme, we packaged a multi-qubit chip and per- formed single-qubit and two-qubit quantum gate operations. The results indicate that this 3D architecture provides a promising scheme for scalable quantum computing.

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• 3D integrated superconducting qubits
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• Combining Topological Hardware and Topological Software: Color Code Quantum Computing with Topological Superconductor Networks
• General method for extracting the quantum efficiency of dispersive qubit readout in circuit QED
• Microwave Package Design for Superconducting Quantum Processors
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• High Coherence Plane Breaking Packaging for Superconducting Qubits
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• Quantum versus Classical Regime in Circuit Quantum Acoustodynamics