activity
20132022
most citedHigh Thermal Conductivity in Wafer Scale Cubic Silicon Carbide Crystals

203 citations · 1.2k across the 24 of their papers we have counts for

collaborators

24 papers

cond-mat.mtrl-sci2022★ 203 cited

High Thermal Conductivity in Wafer Scale Cubic Silicon Carbide Crystals

Zhe Cheng, Jianbo Liang, Keisuke Kawamura +7

High thermal conductivity electronic materials are critical components for high-performance electronic and photonic devices as either active functional materials or thermal managem…

cond-mat.mtrl-sci2022★ 20 cited

Measurements and Numerical Calculations of Thermal Conductivity to Evaluate the Quality of β-Gallium Oxide Thin Films Grown on Sapphire and Silicon Carbide by Molecular Beam Epitaxy

Diego Vaca, Matthew Barry, Luke Yates +8

We report a method to obtain insights into lower thermal conductivity of β-Ga2O3 thin films grown by molecular beam epitaxy (MBE) on c-plane sapphire and 4H-SiC substrates. We comp…

cond-mat.mes-hall2021★ 137 cited

Experimental Observation of Localized Interfacial Phonon Modes

Zhe Cheng, Ruiyang Li, Xingxu Yan +12

Interfaces impede heat flow in micro/nanostructured systems. Conventional theories for interfacial thermal transport were derived based on bulk phonon properties of the materials m…

cond-mat.mtrl-sci2021

Thermal Visualization of Buried Interfaces by Transient and Steady-State Responses of Time-Domain Thermoreflectance

Zhe Cheng, Fengwen Mu, Xiaoyang Ji +6

Thermal resistances from interfaces impede heat dissipation in micro/nanoscale electronics, especially for high-power electronics. Despite the growing importance of understanding i…

cond-mat.mtrl-sci2021

Phonon heat conduction in Al1-xScxN thin films

Chao Yuan, Mingyo Park, Yue Zheng +4

Aluminum scandium nitride alloy (Al1-xScxN) is regarded as a promising material for high-performance acoustic devices used in wireless communication systems. Phonon scattering and…

cond-mat.mtrl-sci2021★ 20 cited

Quasi-Ballistic Thermal Conduction in 6H-SiC

Zhe Cheng, Weifang Lu, Jingjing Shi +9

The minimization of electronics makes heat dissipation of related devices an increasing challenge. When the size of materials is smaller than the phonon mean free paths, phonons tr…