activity
20132022
most citedHigh Thermal Conductivity in Wafer Scale Cubic Silicon Carbide Crystals

203 citations · 1.2k across the 24 of their papers we have counts for

collaborators
Showing 2019Show all

8 papers · 1 filter

cond-mat.mtrl-sci2019★ 38 cited

Substrate Dependent Resistive Switching in Amorphous-HfOx Memristors: An Experimental and Computational Investigation

Pradip Basnet, Darshan G Pahinkar, Matthew P. West +3

While two-terminal HfOX (x<2) memristor devices have been studied for ion transport and current evolution, there have been limited reports on the effect of the long-range thermal e…

cond-mat.mtrl-sci2019★ 183 cited

Experimental Observation of High Intrinsic Thermal Conductivity of AlN

Zhe Cheng, Yee Rui Koh, Abdullah Mamun +17

AlN is an ultra-wide bandgap semiconductor which has been developed for applications including power electronics and optoelectronics. Thermal management of these applications is th…

physics.app-ph2019★ 2 cited

Interfacial Thermal Conductance across Room-Temperature Bonded GaN-Diamond Interfaces for GaN-on-Diamond Devices

Zhe Cheng, Fengwen Mu, Luke Yates +2

The wide bandgap, high-breakdown electric field, and high carrier mobility makes GaN an ideal material for high-power and high-frequency electronics applications such as wireless c…

physics.app-ph2019★ 133 cited

Integration of Atomic Layer Epitaxy Crystalline Ga2O3 on Diamond for Thermal Management

Zhe Cheng, Virginia D. Wheeler, Tingyu Bai +6

Ga2O3 has attracted great attention for electronic device applications due to its ultra-wide bandgap, high breakdown electric field, and large-area affordable substrates grown from…

physics.app-ph2019★ 79 cited

Thermal Conductance Across Harmonic-matched Epitaxial Al-sapphire Heterointerfaces

Zhe Cheng, Yee Rui Koh, Habib Ahmad +17

A unified understanding of interfacial thermal transport is missing due to the complicated nature of interfaces which involves complex factors such as interfacial bonding, interfac…

physics.app-ph2019★ 2 cited

High Thermal Boundary Conductance across Bonded Heterogeneous GaN-SiC Interfaces

Fengwen Mu, Zhe Cheng, Jingjing Shi +5

GaN-based HEMTs have the potential to be widely used in high-power and high-frequency electronics while their maximum output powers are limited by high channel temperature induced…