activity
20172023
most citedObfuscating the Interconnects: Low-Cost and Resilient Full-Chip Layout Camouflaging

52 citations · 584 across the 43 of their papers we have counts for

collaborators
Showing 2019Show all

10 papers · 1 filter

cs.CR2019

ScanSAT: Unlocking Static and Dynamic Scan Obfuscation

Lilas Alrahis, Muhammad Yasin, Nimisha Limaye +4

While financially advantageous, outsourcing key steps, such as testing, to potentially untrusted Outsourced Assembly and Test (OSAT) companies may pose a risk of compromising on-ch…

cs.CR2019★ 27 cited

A Modern Approach to IP Protection and Trojan Prevention: Split Manufacturing for 3D ICs and Obfuscation of Vertical Interconnects

Satwik Patnaik, Mohammed Ashraf, Ozgur Sinanoglu +1

Split manufacturing (SM) and layout camouflaging (LC) are two promising techniques to obscure integrated circuits (ICs) from malicious entities during and after manufacturing. Whil…

cs.CR2019

Is Robust Design-for-Security Robust Enough? Attack on Locked Circuits with Restricted Scan Chain Access

Nimisha Limaye, Abhrajit Sengupta, Mohammed Nabeel +1

The security of logic locking has been called into question by various attacks, especially a Boolean satisfiability (SAT) based attack, that exploits scan access in a working chip.…

physics.app-ph2019★ 18 cited

Toward Physically Unclonable Functions from Plasmonics-Enhanced Silicon Disc Resonators

Johann Knechtel, Jacek Gosciniak, Alabi Bojesomo +3

The omnipresent digitalization trend has enabled a number of related malicious activities, ranging from data theft to disruption of businesses, counterfeiting of devices, and ident…

cs.CR2019★ 11 cited

3D Integration: Another Dimension Toward Hardware Security

Johann Knechtel, Satwik Patnaik, Ozgur Sinanoglu

We review threats and selected schemes concerning hardware security at design and manufacturing time as well as at runtime. We find that 3D integration can serve well to enhance th…

cs.CR2019★ 3 cited

An Interposer-Based Root of Trust: Seize the Opportunity for Secure System-Level Integration of Untrusted Chiplets

Mohammed Nabeel, Mohammed Ashraf, Satwik Patnaik +3

Leveraging 2.5D interposer technology, we advocate the integration of untrusted commodity components/chiplets with physically separate, entrusted logic components. Such organizatio…