15 citations · 25 across the 3 of their papers we have counts for
4 papers
Thermal Characterization of Buried Interfaces in Multilayer Heterostructures via TDTR with Periodic Waveform Analysis
Mingzhen Zhang, Puqing Jiang, Ronggui Yang
Accurate evaluation of buried thermal interfaces is vital for understanding and optimizing heat dissipation in wide- and ultra-wide-bandgap (WBG/UWBG) semiconductor devices. Conven…
Depth-Resolved Thermal Conductivity of HFCVD Diamond Films via Square-Pulsed Thermometry
Kexin Zhang, Xiaosong Han, Ershuai Yin +3
The integration of high-thermal-conductivity diamond films onto silicon carbide (SiC) substrates offers a promising pathway for thermal management in high-power electronic devices.…
Three-dimensional (3D) tensor-based methodology for characterizing 3D anisotropic thermal conductivity tensor
Dihui Wang, Heng Ban, Puqing Jiang
The increasing complexity of advanced materials with anisotropic thermal properties necessitates more generic and efficient methods to determine three-dimensional (3D) anisotropic…
Spatially resolved lock-in micro-thermography (SR-LIT): A tensor analysis-enhanced method for anisotropic thermal characterization
Dihui Wang, Heng Ban, Puqing Jiang
While high-throughput (HT) computations have streamlined the discovery of promising new materials, experimental characterization remains challenging and time-consuming. One signifi…