15 citations · 25 across the 3 of their papers we have counts for
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physics.app-ph2026
Thermal Characterization of Buried Interfaces in Multilayer Heterostructures via TDTR with Periodic Waveform Analysis
Mingzhen Zhang, Puqing Jiang, Ronggui Yang
Accurate evaluation of buried thermal interfaces is vital for understanding and optimizing heat dissipation in wide- and ultra-wide-bandgap (WBG/UWBG) semiconductor devices. Conven…
cond-mat.mtrl-sci2026
Depth-Resolved Thermal Conductivity of HFCVD Diamond Films via Square-Pulsed Thermometry
Kexin Zhang, Xiaosong Han, Ershuai Yin +3
The integration of high-thermal-conductivity diamond films onto silicon carbide (SiC) substrates offers a promising pathway for thermal management in high-power electronic devices.…