activity
20212025
most cited3D System Design: A Case for Building Customized Modular Systems in 3D

2 citations · 3 across the 5 of their papers we have counts for

collaborators

7 papers

cs.CR2025

Leveraging 3D Technologies for Hardware Security: Opportunities and Challenges

Peng Gu, Shuangchen Li, Dylan Stow +4

3D die stacking and 2.5D interposer design are promising technologies to improve integration density, performance and cost. Current approaches face serious issues in dealing with e…

cs.CR2025

Thermal-Aware 3D Design for Side-Channel Information Leakage

Dylan Stow, Russell Barnes, Eren Kurshan +1

Side-channel attacks are important security challenges as they reveal sensitive information about on-chip activities. Among such attacks, the thermal side-channel has been shown to…

cs.AR2025

Through Silicon Via Aware Design Planning for Thermally Efficient 3-D Integrated Circuits

Yibo Chen, Eren Kurshan, Dave Motschman +2

3-D integrated circuits (3-D ICs) offer performance advantages due to their increased bandwidth and reduced wire-length enabled by through-silicon-via structures (TSVs). Traditiona…

cs.AR2025

Fine Grain 3D Integration for Microarchitecture Design Through Cube Packing Exploration

Yongxiang Liu, Yuchun Ma, Eren Kurshan +2

Most previous 3D IC research focused on stacking traditional 2D silicon layers, so the interconnect reduction is limited to inter-block delays. In this paper, we propose techniques…

cs.ET2024

Is 3D chip technology the next growth engine for performance improvement?

Philip Emma, Eren Kurshan

The semiconductor industry is reaching a fascinating confluence in several evolutionary trends that will likely lead to a number of revolutionary changes in how computer systems ar…

cs.DC2024★ 2 cited

3D System Design: A Case for Building Customized Modular Systems in 3D

Philip Emma, Eren Kurshan

3D promises a new dimension in composing systems by aggregating chips. Literally. While the most common uses are still tightly connected with its early forms as a packaging technol…

cs.LG2021★ 1 cited

Label Augmentation via Time-based Knowledge Distillation for Financial Anomaly Detection

Hongda Shen, Eren Kursun

Detecting anomalies has become increasingly critical to the financial service industry. Anomalous events are often indicative of illegal activities such as fraud, identity theft, n…