2 citations · 3 across the 5 of their papers we have counts for
4 papers · 1 filter
Leveraging 3D Technologies for Hardware Security: Opportunities and Challenges
Peng Gu, Shuangchen Li, Dylan Stow +4
3D die stacking and 2.5D interposer design are promising technologies to improve integration density, performance and cost. Current approaches face serious issues in dealing with e…
Thermal-Aware 3D Design for Side-Channel Information Leakage
Dylan Stow, Russell Barnes, Eren Kurshan +1
Side-channel attacks are important security challenges as they reveal sensitive information about on-chip activities. Among such attacks, the thermal side-channel has been shown to…
Through Silicon Via Aware Design Planning for Thermally Efficient 3-D Integrated Circuits
Yibo Chen, Eren Kurshan, Dave Motschman +2
3-D integrated circuits (3-D ICs) offer performance advantages due to their increased bandwidth and reduced wire-length enabled by through-silicon-via structures (TSVs). Traditiona…
Fine Grain 3D Integration for Microarchitecture Design Through Cube Packing Exploration
Yongxiang Liu, Yuchun Ma, Eren Kurshan +2
Most previous 3D IC research focused on stacking traditional 2D silicon layers, so the interconnect reduction is limited to inter-block delays. In this paper, we propose techniques…