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cs.CR2025
Leveraging 3D Technologies for Hardware Security: Opportunities and Challenges
Peng Gu, Shuangchen Li, Dylan Stow +4
3D die stacking and 2.5D interposer design are promising technologies to improve integration density, performance and cost. Current approaches face serious issues in dealing with e…
cs.CR2025
Thermal-Aware 3D Design for Side-Channel Information Leakage
Dylan Stow, Russell Barnes, Eren Kurshan +1
Side-channel attacks are important security challenges as they reveal sensitive information about on-chip activities. Among such attacks, the thermal side-channel has been shown to…