71 citations · 123 across the 3 of their papers we have counts for
8 papers
Fabrication of superconducting through-silicon vias
Justin L. Mallek, Donna-Ruth W. Yost, Danna Rosenberg +15
Increasing circuit complexity within quantum systems based on superconducting qubits necessitates high connectivity while retaining qubit coherence. Classical micro-electronic syst…
Microwave Package Design for Superconducting Quantum Processors
Sihao Huang, Benjamin Lienhard, Greg Calusine +10
Solid-state qubits with transition frequencies in the microwave regime, such as superconducting qubits, are at the forefront of quantum information processing. However, high-fideli…
Comparison of Dielectric Loss in Titanium Nitride and Aluminum Superconducting Resonators
Alexander Melville, Greg Calusine, Wayne Woods +8
Lossy dielectrics are a significant source of decoherence in superconducting quantum circuits. In this report, we model and compare the dielectric loss in bulk and interfacial diel…
Solid-state qubits integrated with superconducting through-silicon vias
Donna-Ruth W. Yost, Mollie E. Schwartz, Justin Mallek +14
As superconducting qubit circuits become more complex, addressing a large array of qubits becomes a challenging engineering problem. Dense arrays of qubits benefit from, and may re…
Silicon Hard-Stop Spacers for 3D Integration of Superconducting Qubits
Bethany M. Niedzielski, David K. Kim, Mollie E. Schwartz +9
As designs for superconducting qubits become more complex, 3D integration of two or more vertically bonded chips will become necessary to enable increased density and connectivity.…
3D integration and packaging for solid-state qubits
D. Rosenberg, S. Weber, D. Conway +9
Developing a packaging scheme that meets all of the requirements for operation of solid-state qubits in a cryogenic environment can be a formidable challenge. In this article, we d…