412 citations · 1.6k across the 15 of their papers we have counts for
4 papers · 1 filter
Solid-state qubits integrated with superconducting through-silicon vias
Donna-Ruth W. Yost, Mollie E. Schwartz, Justin Mallek +14
As superconducting qubit circuits become more complex, addressing a large array of qubits becomes a challenging engineering problem. Dense arrays of qubits benefit from, and may re…
Silicon Hard-Stop Spacers for 3D Integration of Superconducting Qubits
Bethany M. Niedzielski, David K. Kim, Mollie E. Schwartz +9
As designs for superconducting qubits become more complex, 3D integration of two or more vertically bonded chips will become necessary to enable increased density and connectivity.…
3D integration and packaging for solid-state qubits
D. Rosenberg, S. Weber, D. Conway +9
Developing a packaging scheme that meets all of the requirements for operation of solid-state qubits in a cryogenic environment can be a formidable challenge. In this article, we d…
Microwave Packaging for Superconducting Qubits
Benjamin Lienhard, Jochen Braumüller, Wayne Woods +8
Over the past two decades, the performance of superconducting quantum circuits has tremendously improved. The progress of superconducting qubits enabled a new industry branch to em…