High-Mobility Tri-Gate -GaO MESFETs with a Power Figure of Merit over 0.9 GW/cm
arXiv:2206.12539 · doi:10.1109/LED.2022.3196305
Abstract
In this letter, fin-shape tri-gate -GaO lateral MESFETs are demonstrated with a high power figure of merit of 0.95 GW/cm - a record high for any -GaO transistor to date. A low-temperature undoped buffer-channel stack design is developed which demonstrates record high Hall and drift electron mobilities in doped -GaO channels allowing for low ON resistances R in -GaO MESFETs. Fin-widths (W) were 1.2-1.5 m and there were 25 fins (N) per device with a trench depth of 1m. A -GaO MESFET with a source-drain length of 6.4 m exhibits a high ON current (187 mA/mm), low R (20.5 .mm) and a high average breakdown field (4.2 MV/cm). All devices show very low reverse leakage until catastrophic breakdown for breakdown voltages scaled from 1.1kV to 3kV. This work demonstrates the potential of channel engineering in improving -GaO device performance toward lower conduction losses for low-to-medium voltage applications.
4 pages, 5 pages
References in corpus (4)
- Metal Dielectric Heterojunction Diode with 5.7 MV/cm Breakdown Field
- Multi-kV class -GaO MESFETs with a Lateral Figure of Merit up to 355 MW/cm
- Low Temperature Homoepitaxy Of (010) -GaO By Metalorganic Vapor Phase Epitaxy : Expanding The Growth Window
- 4.4 kV -GaO Power MESFETs with Lateral Figure of Merit exceeding 100 MW/cm