Epitaxial (111) Films of Cu, Ni, and Cu_y_2_3$(0001) for Graphene Growth by Chemical Vapor Deposition
arXiv:1205.0833 · doi:10.1063/1.4754013
Abstract
Films of (111)-textured Cu, Ni, and CuNi were evaluated as substrates for chemical vapor deposition of graphene. A metal thickness of 400 nm to 700 nm was sputtered onto a substrate of AlO(0001) at temperatures of 250 C to 650 C. The films were then annealed at 1000 C in a tube furnace. X-ray and electron backscatter diffraction measurements showed all films have (111) texture but have grains with in-plane orientations differing by . The in-plane epitaxial relationship for all films was ||. Reactive sputtering of Al in O before metal deposition resulted in a single in-plane orientation over 97 % of the Ni film but had no significant effect on the Cu grain structure. Transmission electron microscopy showed a clean Ni/AlO interface, confirmed the epitaxial relationship, and showed that formation of the twin grains was associated with features on the AlO surface. Increasing total pressure and Cu vapor pressure during annealing decreased the roughness of Cu and and CuNi films. Graphene grown on the Ni(111) films was more uniform than that grown on polycrystalline Ni/SiO films, but still showed thickness variations on a much smaller length scale than the distance between grains.
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Cited by in corpus (5)
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- The influence of residual oxidizing impurities on the synthesis of graphene by atmospheric pressure chemical vapor deposition
- Restoring self-limited growth of single-layer graphene on copper foil via backside coating
- Studying Pulsed Laser Deposition conditions for Ni/C-based multi-layers