5 citations
2 papers
cs.ET2016★ 5 cited
Routability in 3D IC Design: Monolithic 3D vs. Skybridge 3D CMOS
Jiajun Shi, Mingyu Li, Santosh Khasanvis +2
Conventional 2D CMOS technology is reaching fundamental scaling limits, and interconnect bottleneck is dominating integrated circuit (IC) power and performance. While 3D IC technol…
cs.ET2016★ 1 cited
Skybridge-3D-CMOS: A Vertically-Composed Fine-Grained 3D CMOS Integrated Circuit Technology
Mingyu Li, Jiajun Shi, Mostafizur Rahman +3
Parallel and monolithic 3D integration directions offer pathways to realize 3D integrated circuits (ICs) but still lead to layer-by-layer implementations, each functional layer bei…