19 citations · 26 across the 4 of their papers we have counts for
4 papers
Routability in 3D IC Design: Monolithic 3D vs. Skybridge 3D CMOS
Jiajun Shi, Mingyu Li, Santosh Khasanvis +2
Conventional 2D CMOS technology is reaching fundamental scaling limits, and interconnect bottleneck is dominating integrated circuit (IC) power and performance. While 3D IC technol…
Skybridge-3D-CMOS: A Vertically-Composed Fine-Grained 3D CMOS Integrated Circuit Technology
Mingyu Li, Jiajun Shi, Mostafizur Rahman +3
Parallel and monolithic 3D integration directions offer pathways to realize 3D integrated circuits (ICs) but still lead to layer-by-layer implementations, each functional layer bei…
Manufacturing Pathway and Experimental Demonstration for Nanoscale Fine-Grained 3-D Integrated Circuit Fabric
Mostafizur Rahman, Jiajun Shi, Mingyu Li +2
At sub-20nm technologies CMOS scaling faces severe challenges primarily due to fundamental device scaling limitations, interconnection overhead and complex manufacturing. Migration…
Skybridge: 3-D Integrated Circuit Technology Alternative to CMOS
Mostafizur Rahman, Santosh Khasanvis, Jiajun Shi +2
Continuous scaling of CMOS has been the major catalyst in miniaturization of integrated circuits (ICs) and crucial for global socio-economic progress. However, scaling to sub-20nm…