38 citations · 64 across the 6 of their papers we have counts for
6 papers
Routability in 3D IC Design: Monolithic 3D vs. Skybridge 3D CMOS
Jiajun Shi, Mingyu Li, Santosh Khasanvis +2
Conventional 2D CMOS technology is reaching fundamental scaling limits, and interconnect bottleneck is dominating integrated circuit (IC) power and performance. While 3D IC technol…
Skybridge-3D-CMOS: A Vertically-Composed Fine-Grained 3D CMOS Integrated Circuit Technology
Mingyu Li, Jiajun Shi, Mostafizur Rahman +3
Parallel and monolithic 3D integration directions offer pathways to realize 3D integrated circuits (ICs) but still lead to layer-by-layer implementations, each functional layer bei…
Manufacturing Pathway and Experimental Demonstration for Nanoscale Fine-Grained 3-D Integrated Circuit Fabric
Mostafizur Rahman, Jiajun Shi, Mingyu Li +2
At sub-20nm technologies CMOS scaling faces severe challenges primarily due to fundamental device scaling limitations, interconnection overhead and complex manufacturing. Migration…
Self-similar Magneto-electric Nanocircuit Technology for Probabilistic Inference Engines
Santosh Khasanvis, Mingyu Li, Mostafizur Rahman +5
Probabilistic graphical models are powerful mathematical formalisms for machine learning and reasoning under uncertainty that are widely used for cognitive computing. However they…
Nanowire Volatile RAM as an Alternative to SRAM
Mostafizur Rahman, Santosh Khasanvis, Csaba Andras Moritz
Maintaining benefits of CMOS technology scaling is becoming challenging due to increased manufacturing complexities and unwanted passive power dissipations. This is particularly ch…
Skybridge: 3-D Integrated Circuit Technology Alternative to CMOS
Mostafizur Rahman, Santosh Khasanvis, Jiajun Shi +2
Continuous scaling of CMOS has been the major catalyst in miniaturization of integrated circuits (ICs) and crucial for global socio-economic progress. However, scaling to sub-20nm…