34 citations
Counting papers with at most 25 authors, so collaboration author lists do not stand in for the people here.
- University College LondonGB3 papers
- Diamond Light SourceGB2 papers
- Austrian Centre for Electron Microscopy and NanoanalysisAT1 paper
- Barcelona Supercomputing CenterES1 paper
- B M Birla Science CentreIN1 paper
- CentraleSupélecFR1 paper
- Centre National de la Recherche ScientifiqueFR1 paper
- École Centrale ParisFR1 paper
- Imperial College LondonGB1 paper
- Infineon Technologies (Germany)DE1 paper
- Jadavpur UniversityIN1 paper
- Laboratoire de Mécanique des Sols, Structures et MatériauxFR1 paper
3 papers · 1 filter
First principles study on the segregation of metallic solutes and non-metallic impurities in Cu grain boundary
Vasileios Fotopoulos, Jack Strand, Manuel Petersmann +1
Metallic dopants have the potential to increase the mechanical strength of polycrystalline metals. These elements are expected to aggregate in regions of lower coordination, such a…
Evaluation of the Thermal Stability of TiW/Cu Heterojunctions Using a Combined SXPS and HAXPES Approach
Curran Kalha, Michael Reisinger, Pardeep. K. Thakur +7
Power semiconductor device architectures require the inclusion of a diffusion barrier to suppress, or at best prevent the interdiffusion between the copper metallisation interconne…
Thermal and Oxidation Stability of TiW Diffusion Barriers Investigated by Soft and Hard X-ray Photoelectron Spectroscopy
Curran Kalha, Sebastian Bichelmaier, Nathalie K. Fernando +10
The binary alloy of titanium-tungsten (TiW) is an established diffusion barrier in high-power semiconductor devices, owing to its ability to suppress the diffusion of copper from t…