18 citations · 25 across the 3 of their papers we have counts for
3 papers
Capturing the dynamics of Ti diffusion across TiW/Cu heterostructures using X-ray photoelectron spectroscopy
Curran Kalha, Pardeep K. Thakur, Tien-Lin Lee +4
Interdiffusion phenomena between adjacent materials are highly prevalent in semiconductor device architectures and can present a major reliability challenge for the industry. To fu…
Evaluation of the Thermal Stability of TiW/Cu Heterojunctions Using a Combined SXPS and HAXPES Approach
Curran Kalha, Michael Reisinger, Pardeep. K. Thakur +7
Power semiconductor device architectures require the inclusion of a diffusion barrier to suppress, or at best prevent the interdiffusion between the copper metallisation interconne…
Thermal and Oxidation Stability of TiW Diffusion Barriers Investigated by Soft and Hard X-ray Photoelectron Spectroscopy
Curran Kalha, Sebastian Bichelmaier, Nathalie K. Fernando +10
The binary alloy of titanium-tungsten (TiW) is an established diffusion barrier in high-power semiconductor devices, owing to its ability to suppress the diffusion of copper from t…