activity
20092026
most citedHigh-fidelity, high-scalability two-qubit gate scheme for superconducting qubits

210 citations · 1.2k across the 33 of their papers we have counts for

collaborators
Showing 2017Show all

7 papers · 1 filter

quant-ph2017★ 41 cited

Two-photon driven Kerr resonator for quantum annealing with three-dimensional circuit QED

Peng Zhao, Zhenchuan Jin, Peng Xu +3

We propose a realizable circuit QED architecture for engineering states of a superconducting resonator off-resonantly coupled to an ancillary superconducting qubit. The qubit-reson…

quant-ph2017★ 17 cited

Quantum simulation of general semi-classical Rabi model beyond strong driving regime

Kunzhe Dai, Haiteng Wu, Peng Zhao +6

We propose a scheme to simulate the interaction between a two-level system and a classical light field. Under the transversal driving of two microwave tones, the system Hamiltonian…

quant-ph2017★ 132 cited

Topological Maxwell Metal Bands in a Superconducting Qutrit

Xinsheng Tan, Dan-Wei Zhang, Qiang Liu +6

We experimentally explore the topological Maxwell metal bands by mapping the momentum space of condensed-matter models to the tunable parameter space of superconducting quantum cir…

quant-ph2017★ 23 cited

Circuit QED with qutrit: coupling three or more atoms via virtual photon exchange

Peng Zhao, Xinsheng Tan, Haifeng Yu +2

We present a model to describe a generic circuit QED system which consists of multiple artificial three-level atoms, namely qutrits, strongly coupled to a cavity mode. When the sta…

quant-ph2017★ 28 cited

Anti-Kibble-Zurek behavior of a noisy transverse-field XY chain and its quantum simulation with two-level systems

Zhi-Peng Gao, Dan-Wei Zhang, Yang Yu +1

We study the dynamics of a transverse-field XY chain driven across quantum critical points by noisy control fields. We characterize the defect density as a function of the quench t…

quant-ph2017★ 21 cited

Extensible 3D architecture for superconducting quantum computing

Qiang Liu, Mengmeng Li, Kunzhe Dai +5

Using a multi-layered printed circuit board, we propose a 3D architecture suitable for packaging supercon- ducting chips, especially chips that contain two-dimensional qubit arrays…